Photoresist dispense method by compensation for substrate reflectivity
US6319735A · kind A · utility
1Cited by
11References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 30, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02118
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the manufacture of a semiconductor device, a method for forming a layer on a semiconductor substrate compensates for variations in wafer substrate reflectivity. The method includes providing substrate illumination and then adjusting the illumination on the substrate. The method also includes controlling the dispensation of material over the substrate as a function of the adjusted illumination. By compensating for variations in wafer substrate reflectivity, manufacturing processes can realize more consistent photoresist coatings on wafer substrates from one wafer lot to another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.