Method for forming solder bumps
US6319810A · kind A · utility
29Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1996 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Jun 6, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.