Package comprising low application temperature hot melt adhesive comprising ethylene .alpha.-olefin

US6319979A · kind A · utility

Assignees

• THE DOW CHEMICAL COMPANY · US
• H.B. Fuller Licensing & Financing, Inc · US

Inventors

• Robert A. Dubois · Marion, US
• Cynthia L. Rickey · Lake Jackson, US
• Steven W. Albrecht · Forest Lake, US
• Thomas F. Kauffman · Phillipsburg, US
• Beth M. Eichler · Saint Paul, US
• Maynard R. Lawrence · Oakdale, US
• Thomas H. Quinn · Windom, US

Key dates

• Filing date: Feb 2, 2000
• Grant date: Nov 20, 2001
• Expiry date: Feb 2, 2020

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S206/813
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350.degree. F. (177.degree. C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: PA1 a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C.sub.3 -C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and PA1 b) up to 60 weight percent of at least one tackifying resin; and PA1 c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150.degree. C.