Substrate inspection using the propagation characteristics of RF electromagnetic waves
US6320401A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N22/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate inspection device successively stacks a first electrode plate, a standard substrate, a second electrode plate, a sample substrate, and a third electrode plate, in that order, with the sample substrate and the standard substrate placed in symmetrical opposition. A network analyzer both measures the propagation characteristics of RF electromagnetic waves from the second electrode plate to the first electrode plate as standard characteristics and measures the propagation characteristics of RF electromagnetic waves from the second electrode plate to the third electrode plate as the test characteristics. The quality of the sample substrate can be determined by comparing the measured standard characteristics with the test characteristics, thereby enabling, for example, the simple detection of defects inside a multilayer sample substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.