Multiple layer hinged enclosure
US6321925A · kind A · utility
18Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2001 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Jan 23, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D21/083
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A multiple layer hinged enclosure utilizes two sets of parallel hinge pins to be able to stack as many layers as desired. An outer set of hinge pins is utilized by the cover and an inner set of hinge pins is utilized by intermediate layers to form an offset "shingle"effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.