Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame
US6321971A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1998 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Oct 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die collet for a semiconductor chip having an exposed electrical structure, the die collet including a body having a vacuum line connected thereto, the die collet including a plurality of parts each having a vacuum hole communicating with the vacuum line. Apparatus for bonding a semiconductor chip to a lead frame, the apparatus including a first die collet for picking up the semiconductor chip, on aligning stage for receiving the semiconductor chip from the first pickup tool and aligning the semiconductor chip. A second die collet picks up the semiconductor chip from the aligning stage and places the semiconductor chip on a lead frame. The first and second die collets are constructed as described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.