Resist stripping composition and process for stripping resist
US6323169A · kind A · utility
42Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2000 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Mar 3, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An aqueous resist stripping composition contains (a) an oxidizing agent, (b) a chelating agent, (c) a water-soluble fluorine compound, and optionally (d) an organic solvent. Also provided is a process of stripping resist films and resist residues remaining after etching treatment utilizing the aqueous resist stripping composition. In the process, corrosion of semiconductor materials, circuit-forming materials, insulating films, etc. is minimized and the rinsing is sufficiently made with only water without needing organic solvent such as alcohol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.