Low dielectric constant materials with improved thermal and mechanical properties
US6323297A · kind A · utility
14Cited by
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22Claims
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Key dates
| Filing date | Oct 24, 1997 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Oct 24, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/30
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
New starting materials and methods are used to make materials with low dielectric constant through the processes of transport polymerization or chemical vapor deposition. The starting materials and precursors are designed to provide polymers with combined low dielectric constant, high thermal stability and high mechanical strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.