Circuit board and production method thereof
US6323434A · kind A · utility
11Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1998 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Nov 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a circuit substrate containing a conductive circuit on an insulating base, an electrode for connection to an IC and an electrode for connection to a mother board substrate, which eliminates the step of bonding the film-like insulating base and the conductive circuit to simplify the manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.