Apparatus for packaging semiconductor device and method for packaging the same
US6326240A · kind A · utility
22Cited by
8References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 16, 1999 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Feb 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for packaging a semiconductor device and a method for packaging the same. The apparatus includes a closed printing chamber having a baseplate on the bottom of the closed printing chamber. A pressure controlling system is connected to the closed printing chamber. The baseplate includes a heating unit. A paste source tank is located in the closed printing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.