Copper electroless deposition on a titanium-containing surface
US6326303A · kind A · utility
33Cited by
22References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2000 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/976
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.