Heat sink with integrated fluid circulation pump
US6327145A · kind A · utility
50Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2000 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Sep 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device including a base portion having a plurality of projections extending radially therefrom. A cooling fluid and circulation tubes are used to increase the efficiency of the heat dissipation device by pumping the heat (via the cooling fluid) from the hot base portion to the tips of the projections. The cooling fluid is circulated by a small centrifugal pump, which is driven by a fan attached to the heat dissipation device used for creating forced air-cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.