Inventor · Hillsboro, OR, US

Bin Lian

16Patents
8h-index
8Co-inventors
61Inventor score

Filing activity: Dec 20, 1999 → Apr 28, 2011

Most-cited inventions

PatentTitleAreaCited byStatus
US6521516B2 Process for local on-chip cooling of semiconductor devices using buried microchannels Electricity 62 Expired
US6550531B1 Vapor chamber active heat sink Electricity 53 Expired
US6327145A Heat sink with integrated fluid circulation pump Electricity 50 Expired
US6731221B1 Electrically modifiable product labeling Emerging Cross-Sectional Technologies 26 Expired
US6648506B2 Fluorescence emission ratio imaging thermography for use in heat transfer analysis Physics 24 Expired
US6486589B1 Circuit card assembly having controlled vibrational properties Electricity 19 Expired
US6752204B2 Iodine-containing thermal interface material Electricity 16 Expired
US8968684B2 Microplates, reaction modules and detection systems Emerging Cross-Sectional Technologies 8 Active
US6775122B1 Circuit board with added impedance Electricity 7 Expired
US6649937B2 Semiconductor device with components embedded in backside diamond layer Emerging Cross-Sectional Technologies 6 Expired
US6774310B1 Surface mount connector lead Emerging Cross-Sectional Technologies 5 Expired
US6359372B1 Circuit card assembly having controlled expansion properties Electricity 4 Expired
US6913999B2 Semiconductor device with components embedded in backside diamond layer Emerging Cross-Sectional Technologies 2 Expired
US6624643B2 Apparatus and method to read output information from a backside of a silicon device Physics 0 Expired
US7057114B2 Circuit board with added impedance Electricity 0 Expired
US6797085B1 Metallurgically enhanced heat sink Electricity 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.