Universal cleaning wafer for a plasma chamber

US6328041A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Jeffrey J. Brown · Palmyra, US
• Christopher N. Collins · Poughkeepsie, US
• Wilson Tong Lee · Hopewell Junction, US
• George A. Kaplita · New Windsor, US
• Stefan Schmitz · Stuttgart, DE
• Len Yuan Tsou · New City, US

Key dates

• Filing date: Sep 18, 1998
• Grant date: Dec 11, 2001
• Expiry date: Sep 18, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S156/916
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A cleaning wafer is used during the vaporization of particulate deposits that were previously deposited on the walls of a plasma chamber. The cleaning wafer includes a first dielectric layer, a conducting layer and a second dielectric layer covering the conducting layer.