Christopher N. Collins
10Patents
4h-index
33Co-inventors
60Inventor score
Filing activity: Jan 31, 1996 → Oct 25, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5874162A | Weighted sintering process and conformable load tile | Emerging Cross-Sectional Technologies | 62 | Expired |
| US6328041A | Universal cleaning wafer for a plasma chamber | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6188096A | DRAM cell capacitor having increased trench capacitance | Electricity | 6 | Expired |
| US5948193A | Process for fabricating a multilayer ceramic substrate from thin greensheet | Electricity | 4 | Expired |
| US5741131A | Stacking system for substrates | Mechanical Engineering; Lighting; Heating | 4 | Expired |
| US6440813B2 | Process of manufacturing a DRAM cell capacitor having increased trench capacitance | Electricity | 3 | Expired |
| US10170304B1 | Self-aligned nanotube structures | Electricity | 2 | Active |
| US9252133B2 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Electricity | 1 | Active |
| US8907494B2 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Electricity | 1 | Active |
| US10170337B2 | Implant after through-silicon via (TSV) etch to getter mobile ions | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.