Filmy adhesive for connecting circuits and circuit board
US6328844A · kind A · utility
24Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1999 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Aug 24, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40.degree. C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.