Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer
US6329640A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2000 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Oct 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.