Leadframe using chip pad as heat conducting path and semiconductor package adopting the same
US6329706A · kind A · utility
87Cited by
3References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2000 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Aug 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe and a semiconductor package adopting the leadframe, capable of effectively preventing moisture intrusion into the semiconductor package, and preventing flashing and reducing thermal stress on a chip pad during a molding process. The chip pad of the leadframe includes: at least two swaged portions; narrow and long grooves on the first and second surfaces thereof, formed in a V-like or U-like shape along the four sides of the chip pad in a rectangular shape; at least one slot formed along the outside of a chip mount area; and wings adjacent to the slots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.