Bonding pads for integrated circuits having copper interconnect metallization
US6329722A · kind A · utility
50Cited by
25References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1999 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Jul 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device having a thin metallic coating, such as tin which forms strong bonds to copper is provided on the bond pads of an integrated circuit having copper metallization; surface oxidation of the coating is self limiting and the oxides are readily removed, further the coated bond pad forms intermetallics at low temperatures making it both solderable and compatible with wire bonding. A low cost process for forming tin coated copper bonding pads is provided by electroless plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.