Apparatus and method for contacting a sensor conductive layer
US6330145A · kind A · utility
16Cited by
20References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1998 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Dec 30, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1329
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A structure and method is disclosed for grounding an electrostatic discharge device of an integrated circuit to dissipate electrostatic charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry and a conductive layer disposed over the underlying dielectric layer, wherein the conductive layer diffuses electrostatic charges at the surface of the integrated circuit to ground. The conductive material not only dissipates electrostatic charges to the ground, but may also protect at least a portion of the edge of the sensor chip from mechanical stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.