Conductive adhesive having a palladium matrix interface between two metal surfaces
US6331119A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1999 |
| Grant date | Dec 18, 2001 |
| Priority date | — |
| Expiry date | Dec 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12569
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces thereon and the resulting bond is provided. Preferably, the metal surfaces are the surfaces of metal contact pads on a dielectric substrate and on an electronic device such as an I/C chip or chip carrier. The mechanical bond and electrical connection is provided by utilizing a conductive adhesive, in which adhesive the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon, preferably by electrodeposition. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. However, the shape of the particle is not significant. The polymer preferably is conventional polyimide/siloxane which is well known in the art for use in formulating conductive adhesives. The polyimide/siloxane is a thermoplastic, i.e. upon heating it softens and upon cooling it sets…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.