William E. Bernier
35Patents
9h-index
64Co-inventors
78Inventor score
Filing activity: Feb 5, 1981 → May 31, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5847929A | Attaching heat sinks directly to flip chips and ceramic chip carriers | Electricity | 104 | Expired |
| US6069023A | Attaching heat sinks directly to flip chips and ceramic chip carriers | Electricity | 74 | Expired |
| US6425772B1 | Conductive adhesive having a palladium matrix interface between two metal surfaces | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6559666B2 | Method and device for semiconductor testing using electrically conductive adhesives | Electricity | 50 | Expired |
| US6251707A | Attaching heat sinks directly to flip chips and ceramic chip carriers | Electricity | 35 | Expired |
| US4374001A | Electrolytic printing | Performing Operations; Transporting | 19 | Expired |
| US4444626A | Electrochromic printing | Performing Operations; Transporting | 15 | Expired |
| US6288559A | Semiconductor testing using electrically conductive adhesives | Electricity | 11 | Expired |
| US7119003B2 | Extension of fatigue life for C4 solder ball to chip connection | Electricity | 9 | Expired |
| US6550667B2 | Flux composition and soldering method for high density arrays | Electricity | 8 | Expired |
| US6268739A | Method and device for semiconductor testing using electrically conductive adhesives | Electricity | 8 | Expired |
| US8444043B1 | Uniform solder reflow fixture | Electricity | 6 | Active |
| US6255208A | Selective wafer-level testing and burn-in | Electricity | 6 | Expired |
| US7332821B2 | Compressible films surrounding solder connectors | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7170187B2 | Low stress conductive polymer bump | Electricity | 5 | Expired |
| US7566649B2 | Compressible films surrounding solder connectors | Emerging Cross-Sectional Technologies | 4 | Active |
| US6331119A | Conductive adhesive having a palladium matrix interface between two metal surfaces | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7316572B2 | Compliant electrical contacts | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7442878B2 | Low stress conductive polymer bump | Electricity | 3 | Active |
| US8957531B2 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | Electricity | 2 | Active |
| US6492071B1 | Wafer scale encapsulation for integrated flip chip and surface mount technology assembly | Electricity | 2 | Expired |
| US4453171A | Reduced electrode wear in electrolytic printing by pH control of the print reaction zone | Performing Operations; Transporting | 1 | Expired |
| US6585150B1 | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder | Electricity | 0 | Expired |
| US8167962B2 | Pulpstone for long fiber pulp production | Textiles; Paper | 0 | Active |
| US12064753B2 | Metal oxide nanofibrous materials for photodegradation of environmental toxins | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.