Semiconductor device having a BGA structure
US6331738A · kind A · utility
2Cited by
3References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 19, 1999 |
| Grant date | Dec 18, 2001 |
| Priority date | — |
| Expiry date | Nov 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided with a semiconductor chip and a connection lead connected to a pad of the semiconductor chip. The connection lead has a tip part which is bent up to a surface of the semiconductor chip on the opposite side of the pad. The semiconductor device is further provided a resin sealed part covering the semiconductor chip and a solder ball provided on the tip part of the connection lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.