Method/structure for creating aluminum wirebound pad on copper BEOL
US6333559A · kind A · utility
20Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Jan 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the IC structure which contain or do not contain an underlying region of Cu wiring. The present invention also provides a method of interconnecting the fabricated structure to a semiconducting packaging material through the use of a wirebond or Controlled Collapse Chip Connection (C4) solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.