Electrical interconnection package and method thereof
US6333563A · kind A · utility
49Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2000 |
| Grant date | Dec 25, 2001 |
| Priority date | — |
| Expiry date | Jun 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.