Reflow soldering apparatus and reflow soldering method
US6334569B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2000 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Mar 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1581
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A reflow soldering apparatus for soldering a first component mounted on a substrate with a first solder having a first melting point and soldering a second component mounted on the substrate with a second solder having a second melting point higher than the first melting point. The reflow soldering apparatus includes a heat source for substantially uniformly heating the substrate, a capsule for enclosing the second component, and a vacuum pump for decreasing the pressure in the capsule. The melting point of the second solder can be lowered by operating the vacuum pump to decrease the pressure in the capsule by a given amount, so that the first component and the second component can be reflow-soldered at substantially the same temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.