Patent · US Expired

Method for making a thin film on a support and resulting structure including an additional thinning stage before heat treatment causes micro-cavities to separate substrate element

US6335258B1 · kind B1 · utility

105Cited by
8References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 18, 1999
Grant dateJan 1, 2002
Priority date
Expiry dateJun 18, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/977
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention relates to a production method for a thin film on a support that includes an ionic implantation stage in order to demarcate the thin film in a substrate, the aim of the ionic implantation being to create a layer of micro-cavities in the substrate, a stage to bond the substrate to a support element using close contact and a heat treatment stage intended to bring the layer of micro-cavities to a temperature that is high enough to cause a split along said layer. At least one of said elements, substrate or support, is thinned before the heat treatment stage in order to maintain the close contact between the substrate and the support despite the stresses caused in the elements and resulting from the difference in their thermal dilation coefficients.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.