Semiconductor flip-chip package and method for the fabrication thereof
US6335571B1 · kind B1 · utility
224Cited by
18References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2000 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Mar 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.