Method and device for determining a parameter for a metallization bath
US6335626B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 22, 2000 |
| Grant date | Jan 1, 2002 |
| Priority date | — |
| Expiry date | Feb 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4007
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and device are provided for determining a parameter for the reproducible production of raised contact metallizations (24, 25) on terminal areas of a substrate. Metallization material is deposited in a metallization bath. A test substrate is employed having at least two terminal areas adjacent at a defined spacing. The substrate is introduced into the metallization bath (10) and the parameter is determined from the variation in an electrical quantity as a consequence of an electrical contact resulting to from the deposition of the metallization material for building up the contact metallizations (24, 25) on the adjacent terminal areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.