Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US6337281B1 · kind B1 · utility
15Cited by
14References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2000 |
| Grant date | Jan 8, 2002 |
| Priority date | — |
| Expiry date | Mar 8, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B23/0021
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.