Apparatus and method for uniformly depositing thin films over substrates
US6338775B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2000 |
| Grant date | Jan 15, 2002 |
| Priority date | — |
| Expiry date | Aug 7, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/547
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film deposition apparatus and method are disclosed in this invention. The method includes a step of providing a vacuum chamber for containing a thin-film particle source for generating thin-film particles to deposit a thin-film on the substrates. The method further includes a step of containing a substrate holder in the vacuum chamber for holding a plurality of substrates having a thin-film deposition surface facing the thin-film particle source. The method further includes a step of providing a rotational means for rotating the substrate holder to rotate each of the substrates exposed to the thin-film particles for depositing a thin film thereon. And, the method further includes a step of providing a lateral moving means for laterally moving and controlling a duration of exposure time across a radial direction for each of the substrates for controlling thickness uniformity of the thin-film deposited on each of the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.