Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells
US6339013B1 · kind B1 · utility
55Cited by
22References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 1997 |
| Grant date | Jan 15, 2002 |
| Priority date | — |
| Expiry date | May 13, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low temperature process for forming a metal doped silicon layer in which a silicon layer is deposited onto a substrate at low temperatures, with a metal doping layer then deposited upon the silicon layer. This structure is then annealed at low temperatures to form a metal doped semiconductor having greater than about 1×1020 dopant atoms per cm3 of silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.