Method and apparatus for enhancing a sputtering target's lifetime
US6340415B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1998 |
| Grant date | Jan 22, 2002 |
| Priority date | — |
| Expiry date | May 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Sputtering target lifetime is enhanced by providing a sputtering target assembly wherein a sputtering target is mounted to a substantially compliant cooling cover plate. The cooling cover plate is preferably fabricated from a plastic, a polymer, or a composite polymer and is provided with a plurality of grooves which form cooling fluid passages when the sputtering target is mounted to the cooling cover plate. These cooling fluid passages may be used to cool the target during sputtering. Because the cooling cover plate is substantially compliant, the sputtering target is free to bow in order to relieve any thermally induced strain produced within the sputtering target during sputtering. The lifetime of the sputtering target is thereby enhanced as both strain induced defect propagation/migration within the sputtering target, and the likelihood of sputtering target/cooling cover plate delamination are reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.