Patent · US Expired

Method of manufacturing a semiconductor device, method of manufacturing a photomask, and a master mask

US6340542B1 · kind B1 · utility

18Cited by
8References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 6, 1999
Grant dateJan 22, 2002
Priority date
Expiry dateDec 6, 2019

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F1/36
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method of manufacturing a semiconductor device, light is applied through the cell patterns made in master masks, thereby transferring the cell patterns to, and forming the cell patterns on, a wafer. On the basis of layout data representing a layout diagram of the semiconductor device, the pattern data of the device is divided along the boundaries of the function blocks of the device, generating pattern data items. Master masks are prepared in accordance with the pattern data items. Light is applied to the wafer, first through the master mask and then through the master mask. The cell patterns made in the master masks are transferred to the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.