Method for applying a protecting lacquer on a wafer

US6340644B1 · kind B1 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Volker Becker · Marxzell, DE
• Franz Laermer · Stuttgart, DE
• Andrea Schilp · Schwäbisch Gmünd, DE

Key dates

• Filing date: Sep 20, 1999
• Grant date: Jan 22, 2002
• Expiry date: Sep 20, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02282
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for applying a protective resist, such as a negative resist, to a prepatterned wafer in which the resist is applied to the previously generated patterns by a distribution system which includes a holder for the wafer, an xy sliding unit with a programming device, and a dispensing device with a syringe.