Copper foil bonding treatment with improved bond strength and resistance to undercutting
US6342308B1 · kind B1 · utility
2Cited by
20References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1999 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Sep 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing layer, and a zinc or zinc alloy layer electrodeposited on the copper/arsenic layer. A process for making such foil, and a copper-clad laminate wherein such foil is bonded to a polymeric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.