Method of manufacturing a flexible circuit board
US6344308B1 · kind B1 · utility
4Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1999 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Nov 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board comprises a polyimide insulating layer 5 with land access holes 3 and a conductor circuit layer 4 provided thereon, and is produced by coating one surface of a conductor circuit metal foil 1 side with a polyimide precursor varnish, which is dried to give a polyimide precursor layer 2, where the polyimide precursor layer 2 is provided with land access holes 3 by a photolithography process; the conductor circuit metal foil 1 is patterned by the subtractive process to form conductor circuit layer 4; and the polyimide precursor layer 4 is then imidated to form polyimide insulating layer 5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.