Method of dicing workpiece
US6344402B1 · kind B1 · utility
79Cited by
2References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2000 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Jul 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a dicing method using a dicing apparatus comprising at least a chuck table holding workpiece attached a frame via an adhesive tape, and dicing means for cutting a workpiece into small square pieces. The workpiece is cut into small square pieces in the state of being held in the frame, and a blow of air is ejected from the surface of the chuck table to the diced workpiece to expand the adhesive tape in the semispherical form. As a result, adjacent square pieces are put apart from each other, thus making adjacent square pieces even if they remain partly contiguous to be forcedly put apart from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.