Method for micro-mechanical structures
US6344417B1 · kind B1 · utility
24Cited by
6References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 2000 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Aug 8, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0192
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating MEMS wherein a structural member is released without using a sacrificial layer. In one embodiment, the method comprises forming a buried hydrogen-rich layer in a semiconductor substrate, defining a release structure in the semiconductor substrate above the buried hydrogen-rich layer, and separating at least a portion of the release structure from the semiconductor substrate by cleaving the semiconductor substrate at the buried hydrogen-rich layer. The method can be used to fabricate hybrid devices wherein a MEMS device and a semiconductor device are formed on the same chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.