Semiconductor device comprising a semiconductor element mounted on a substrate and covered by a wiring board
US6344682B1 · kind B1 · utility
32Cited by
16References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 16, 1999 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Jul 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor element is mounted on a main substrate with its primary surface downward, and the electrodes of the semiconductor element are connected to the electrodes of the main substrate. A wiring board having a wiring pattern is placed on the backside of the semiconductor element. Four corners of the wiring board are connected to the main substrate by means of connection pins. The connection pins are formed so as to become conductive to thereby electrically connect the wiring pattern of the main substrate to the wiring pattern of the wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.