Method and apparatus for immobilizing solder spheres
US6345718B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2000 |
| Grant date | Feb 12, 2002 |
| Priority date | — |
| Expiry date | Feb 9, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/814
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A containing device and method to hold and immobilize solder spheres during storage and transport including a container portion having an open top terminal end and an opposing closed bottom terminal end with at least one side wall connecting each terminal end, a removably attachable lid to seal the container portion and a lid insert for insertion into the container portion to immobilize solder spheres contained therein. In one embodiment, the lid insert is comprised of compressible material, such as a polymeric foam, whereby insertion of the lid insert into the container portion causes compression of the lid insert substantially adjacent to the side wall of the container portion, a bottom planar surface of the lid and an uppermost surface layer of solder spheres to completely fill any open or dead space within the containing device. The lid insert forms a mechanical seal which immobilizes the solder spheres until the lid insert is removed from the containing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.