Method of coating semiconductor wafer with resin and mold used therefor
US6346433B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2000 |
| Grant date | Feb 12, 2002 |
| Priority date | — |
| Expiry date | Mar 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of coating a semiconductor wafer with a resin of the present invention, first, a semiconductor wafer is placed on a bottom surface of a cavity provided in a molding surface of a lower mold of a mold with its surface having a bump facing upward. Thereafter, a required amount of resin material is supplied to cavity, and a film for exposing the bump is applied to a molding surface of the upper one of the molds. In this state, molds are closed together. Resin material is heated to melt in cavity. Then, film is pressed against the bottom surface of cavity by a pressing member provided on the molding surface of the upper mold, so that film is abutted against a leading edge of bump in cavity. A pressure is applied to the resin in cavity through film, and the surface having the bump of semiconductor wafer is coated with resin. According to the method, pressing member is provided on the upper mold, so that melted resin does not enter a sliding portion. Accordingly, productivity of the resin-coated wafer increases and a resin-coated wafer with high quality and reliability is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.