Slurry dispensing carrier ring
US6347979B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 1998 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Sep 29, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A slurry dispensing carrier ring for confining a semiconductor wafer to a polishing pad in a chemical mechanical polishing machine. The slurry dispensing ring has a diameter and a lower surface substantially parallel to the plane defined by the diameter and an inner radius surface substantially orthogonal to the plane defined by the diameter. The inner radius surface is adapted to confine the semiconductor wafer. An outer radius surface is located opposite the inner radius surface. An upper surface is located opposite the lower surface. A slurry dispense hole extends through the carrier ring from the upper surface to the lower surface, wherein the slurry dispense hole is adapted to flow a slurry used for chemical mechanical polishing from the chemical mechanical polishing machine to the lower surface so that the slurry contacts the semiconductor wafer confined within the inner radius surface. This provides for the more efficient utilization of slurry in the CMP process wherein a planar topography is created on the semiconductor wafer. This facilitates the subsequent semiconductor processing steps performed on the semiconductor wafer and minimizes the amount of wasted slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.