Slurry for mechanical polishing (CMP) of metals and use thereof

US6348076B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Donald F. Canaperi · Bridgewater, US
• William J. Cote · Poughquag, US
• Paul M. Feeney · South Burlington, US
• Mahadevaiyer Krishnan · Hopewell Junction, US
• Joyce C. Liu · Carmel, US
• Michael F. Lofaro · Milton, US
• Philip Murphy · New Fairfield, US
• Eric J. White · Vergennes, US

Key dates

• Filing date: Dec 28, 1999
• Grant date: Feb 19, 2002
• Expiry date: Dec 28, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Slurry compositions comprising an oxidizing agent, copper corrosion inhibitor, abrasive particles; surface active agent and polyelectrolyte are useful for polishing or planarizing chip interconnect/wiring material such as Al, W and especially Cu.