Carrier substrate for producing semiconductor device
US6348416B1 · kind B1 · utility
5Cited by
6References
9Claims
0Family size
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Inventors
Key dates
| Filing date | Dec 6, 1999 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Dec 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.