Hideki Toya
8Patents
5h-index
25Co-inventors
59Inventor score
Filing activity: Jan 5, 1998 → Mar 28, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6107411A | Block copolymer, block copolymer composition and heat shrinkable films made thereof | Chemistry; Metallurgy | 35 | Expired |
| US6410649B1 | Resin composition | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6664133B2 | Lead frame and method of manufacturing the same | Electricity | 6 | Expired |
| US6700198B2 | Resin for semiconductor wire | Electricity | 6 | Expired |
| US6348416B1 | Carrier substrate for producing semiconductor device | Electricity | 5 | Expired |
| US8258236B2 | Tubular forming material and its heat-shrinkable film | Chemistry; Metallurgy | 3 | Active |
| US7470747B2 | Block copolymer mixture and heat shrinkable film using it | Emerging Cross-Sectional Technologies | 2 | Active |
| US9475925B2 | Blended rubber, blended rubber composition and vulcanizate | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.