Electronic chip packaging
US6349032B1 · kind B1 · utility
23Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1999 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Feb 3, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package contains a circuit card to which a chip carrier plate is attached via solder balls. A heat spreader plate, supporting a heat sink, is spring loaded against the semiconductor chip of the carrier plate by means of elastomeric disks disposed upon a spring retainer plate that is, itself, disposed adjacent the chip carrier plate. A plastic cover both protects and supports the heat sink and semiconductor chip. A retention latch is disposed between the cover plate and the spring retainer plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.