Combined CMP and wafer cleaning apparatus and associated methods

US6350177B1 · kind B1 · utility

Assignee

• SpeedFam-IPEC Corporation · US

Inventors

• Jose R. Gonzalez-Martin · Phoenix, US
• Chris Karlsrud · Chandler, US
• Robert F. Allen · Gilbert, US
• Toby Jordan · Gilbert, US
• Craig Howard · Gilbert, US
• Arthur Hamer · Sun Lakes, US
• Jeff Cunnane · Phoenix, US
• Periya Gopalan · Chandler, US
• Bill Thornton · Apache Junction, US
• Jon MacErnie · Chandler, US
• Fernando Calderon · San Fernando, US

Key dates

• Filing date: May 17, 2000
• Grant date: Feb 26, 2002
• Expiry date: May 17, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B41/005
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.