Polishing pad conditioning device with cutting elements
US6350184B1 · kind B1 · utility
5Cited by
8References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 21, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Aug 21, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49982
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utilize brazed diamond technology in association with a coating of a titanium nitride containing composition or a thin film diamond deposition in order to reduce the fracturing and loss of cutting elements bonded to the conditioning ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.