Electro deposition chemistry
US6350366B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Jan 18, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, ie., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.